| ‘? I MSS1 P2L, MSS1 P3L7 www'V'Shay'C°m Vishay General Semiconductor THERMAL cHARAcTE s s otherwise noted) PARAMETER Typical thermal resistance N atell) Thermal resistance from junction to ambient and junction to lead mounted on PCB with 6.0 mm x 6.0 mm copper pad areas RQJL is measured at the terminal of cathode band. RQJC is measured at the top center of the body UNIT WEIGHT (9) PREFERRED PACKAGE CODE DELIVERY MODE 7" diameter plastic tape and reel 7" diameter plastic tape and reel Note ll) Automotive gradeRATINGS AND cHARAcTERIsTIcs cuRvEs (TA : 25 °C unless otherwise noted) I0 01 Instantaneous Forward Current (A) Average Fon?ard Rectified Current (A) 0.01 0 25 50 75 I00 I25 I50 0 0.1 0.2 0.3 0.4 0.5 0.6 0 7 0.5 Lead Temperature (ac) Instantaneous Forward Voltage (V)Fig. 1 - Maximum Forward Current Derating Curve Fig. 3 - Typical Instantaneous Forward Characteristics I00 :3.0 Average Power Loss (W) 0.01 Instantaneous Fleverse Current (mA) 0 0.2 0.4 0.6 0 a I 0 ‘.2Average Forward Current (A) Percent ol Rated Peak Reverse Voltage (%) Fig. 2 - Fonlvard Power Loss Characteristics Fig. 4 - Typical Reverse Characteristics Revision: 25-Jul-13 2 Document Number: 89020 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiQdesEurope@vishay.com THIS DOCUMENT IS SUBJECT To CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vIsha . om doc?9100 |